http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
Outgoing Links
| Predicate | Object |
|---|---|
| level | 8^^<http://www.w3.org/2001/XMLSchema#integer> |
| symbol | C09J2203/326 |
| modified | 2020-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| title | Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors |
| type | http://data.epo.org/linked-data/def/cpc/SubGroup |
| broader | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-00 |
Incoming Links
Total number of triples: 10000.