| abstract |
The present invention relates to an adhesive film which has a thixopropic index of 1.5 to 7.5 at 110°C and is used for fixating a first semiconductor element and a second semiconductor element, the first semiconductor element having an area the ratio of which to an area of the second semiconductor element is 0.65 or lower, and to a method for producing a semiconductor device using the adhesive film and to a semiconductor device using the adhesive film. |