| abstract |
A technical problem of the present invention is to provide an adhesive tape for semiconductor processing that can suppress chip cracks even if it is used for DBG or LDBG. The adhesive tape for semiconductor processing as a solution is an adhesive tape having a substrate, a buffer layer provided on at least one side of the substrate, and an adhesive layer provided on the other side of the substrate. In the adhesive tape for processing, the buffer layer has a Young's modulus of 10 to 400 MPa at 23°C and a fracture energy of 1 to 9 MJ/m 3 , and the Young's modulus of the base material at 23°C is greater than the Young's modulus of the buffer layer. |