http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111739832-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate | 2020-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12bc5b00c78815f2dd10b721001423d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4f1ed54832b5cf422a2565f9c0bfd88 |
| publicationDate | 2020-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111739832-A |
| titleOfInvention | Dicing Tape Integrated Semiconductor Backside Adhesive Film |
| abstract | Provides a dicing tape-integrated semiconductor backside adhesive film with reworkability for lamination. The composite film (X) (dicing tape-integrated semiconductor backside adhesive film) of the present invention includes a film (10) (semiconductor backside adhesive film) and a dicing tape (20). The second peel adhesion force measured in the peel test under the first condition between the test piece from which the film (10) was bonded to the silicon wafer plane at 70°C and the silicon wafer plane was higher than that of the film. (10) The 1st peeling adhesive force measured in the peeling test under predetermined 1st conditions with the dicing tape (20) is large. In addition, the fourth peel adhesion force measured in the peel test under the second condition between the test piece derived from the thin film (10) bonded to the silicon wafer plane at 70°C and the silicon wafer plane was higher than The third peel adhesive force measured in the peel test under the predetermined second condition between the film ( 10 ) and the dicing tape ( 20 ) was small. |
| priorityDate | 2019-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 166.