| abstract |
A photosensitive adhesive composition of the present invention is used for bonding a semiconductor element and a member to be bonded together. The photosensitive adhesive composition includes an alkali soluble resin (A), a photoacid generator (B), an epoxy compound (C) and a phenol compound (D) having a melting point of 50 to 150℃. By using a cured product of the photosensitive adhesive composition of the present invention as an adhesive layer bonding the semiconductor elements together, it is possible to reduce generation of bubbles (voids) at an interface between the semiconductor element and the adhesive layer. Further, even if the bubbles generate at the interface, it is also possible to remove the generated bubbles. As a result, an adhesive property (adhesion property) between the semiconductor elements can be improved. |