| abstract |
[Problem] To provide a method which bonds semiconductor elements, and a bonding structure arising from the bonding method, while ensuring superior conductivity and transparency at an interface. To provide a method which bonds semiconductor elements, and a bonding structure arising from the bonding method, with which it is possible to ensure superior conductivity at the interface, and to design optical characteristics which act advantageously on element characteristics. [Solution] A method which bonds semiconductor elements positions conductive nanoparticles which are not covered with organic molecules on the surface of a semiconductor element with no optical loss, and adhesion presses another semiconductor element thereupon. |