abstract |
An object of the present invention is to make it possible to use as a high-temperature solder substitute without using lead. A composite metal nanoparticle in which the periphery of a core made of metal particles having an average particle diameter of about 100 nm or less is bonded and coated with an organic substance containing C, H and / or O as a main component is used as a main agent for bonding. [Selection diagram] None |