| abstract |
A dicing film with a protective film is provided, which decreases down time and attaches the dicing film onto a semiconductor wafer without causing a position shift. The dicing film with the protective film, wherein the dicing film and the protective film are laminated, features a difference of 20% or more between the transmissivity of the protective film relative to a wavelength of 600nm to 700nm and the transmissivity relative to a wavelength of 600nm to 700nm of a portion of the dicing film with the protective film that the film detecting light for the dicing film firstly permeates. |