| abstract |
The invention relates to a barrier adhesive mass for encapsulating an (opto)electronic assembly, containing: a glue base, which consists of at least one reactive resin having at least one group that can be activated, at least one polymer, in particular an elastomer, and optionally at least one adhesive resin, the glue base having a water vapor permeation rate after the activation of the reactive resin of less than 100 g/m²d, preferably of less than 50 g/m²d, in particular of less than 15 g/m²d; a transparent molecularly dispersed getter material; and optionally a solvent; characterized in that the getter material is at least one silane, which has at least one alkoxy group and at least one group that can be activated. |