patent/WO-2009038020-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009038020-A1

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_607e716532b14d3ad3f8745a553d4753 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8d669f25b765d9d1a90229d1f392c39c http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_25e0776b5e06b043223ef699ba03b5ad http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_704524536b8007983bd05073d6315dab
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1471 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2483-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4824 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07802 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2463-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45015
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-35
filingDate	2008-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e50abc39fbafb81cd31ec37fd3e3c6d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24ed5997a03aef381ce0b5127782a9ee http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0faf21a77e8961fcce137602204fa049 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a9579007a03e813af444af6300271df
publicationDate	2009-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	WO-2009038020-A1
titleOfInvention	Adhesive composition for electronic components and adhesive sheet for electronic components using the same
abstract	Disclosed is an adhesive composition for electronic components, which has excellent adhesion durability, thermal cycle performance and insulation reliability under high temperature conditions over a long time. Specifically disclosed is an adhesive composition for electronic components containing (a) a thermoplastic resin, (b) an epoxy resin, (c) a curing agent and (d) an organopolysiloxane. This adhesive composition for electronic components has a glass transition temperature (Tg) after curing of -10˚C to 50˚C, and the change in Tg after a 1000-hour heat treatment at 175˚C is not more than 15%.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016157669-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023189609-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023189610-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010251555-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016219768-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103409079-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009242606-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017114298-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102746798-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103923586-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103923586-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105082255-A
priorityDate	2007-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate

Subject

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007277525-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005132860-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04293950-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06306338-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002060716-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06256732-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006213872-A

http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5770
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226395003

Total number of triples: 77.