| abstract |
Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer has sinterable metallic particles and an organic component, a 95% weight loss temperature of the organic component is 150° C. or more and 300° C. or less when thermogravimetry of the thermal bonding sheet is performed under an air atmosphere at a heating rate of 10° C./min. |