http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102267636-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2400-163 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 |
| filingDate | 2019-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102267636-B1 |
| titleOfInvention | Adhesive tape for semicondoctor package manufacturing process and method for manufacturing the same |
| abstract | The present technology can protect the lower surface of the semiconductor package and the plurality of protruding electrodes formed on the lower surface of the semiconductor package during a semiconductor package manufacturing process having a plurality of protruding electrodes, and can be easily removed from the semiconductor package without any residue after completing a predetermined manufacturing process. To provide a detachable adhesive tape for a semiconductor package manufacturing process, wherein the adhesive tape for a semiconductor package manufacturing process is attached to a lower surface of a semiconductor package having a plurality of protruding electrodes formed thereon, corresponding to the lower surface topology of the semiconductor package when attached a base film containing metal elements to independently maintain the deformed form between processes; an adhesive layer formed on the base film, the molecular structure of which has a network structure, and containing silicon; And it provides an adhesive tape comprising a fluorine-containing release film attached to the adhesive layer. |
| priorityDate | 2019-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 78.