http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019008808-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
| filingDate | 2018-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2019008808-A1 |
| titleOfInvention | Stealth dicing adhesive sheet and method for manufacturing semiconductor device |
| abstract | A stealth dicing pressure-sensitive adhesive sheet 1 used for cutting and separating at least a semiconductor wafer having a modified layer formed therein into individual chips under an environment of -20 ° C or higher and 10 ° C or lower, A pressure-sensitive adhesive layer comprising a base material 11 and a pressure-sensitive adhesive layer 12 laminated on one surface side of the base material 11, wherein the pressure-sensitive adhesive sheet 1 for stealth dicing is attached to a silicon wafer via the pressure-sensitive adhesive layer 12. A pressure-sensitive adhesive sheet 1 for stealth dicing, wherein the shearing force at 0 ° C. at the interface between 12 and the silicon wafer is 190 N / (3 mm × 20 mm) or more and 400 N / (3 mm × 20 mm) or less. Such a stealth dicing pressure-sensitive adhesive sheet 1 can satisfactorily separate the semiconductor wafer into chips by cool expanding even when the obtained chip size is small. |
| priorityDate | 2017-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 77.