| abstract |
The curable silicone composition for die bonding according to the present invention comprises (A) an organopolysiloxane having two or more alkenyl groups per molecule, (B) two or more per molecule, each of the formula: RHSiO, wherein R is 1 to 12 carbons. an organopolysiloxane having a siloxane unit represented by (C) a platinum group metal-based catalyst for hydrosilylation reaction, (D) a hydrosilylation reaction inhibitor and ( E) contains at least a tackifier, and has a scorch time (ts1) at die bonding temperature of 20 to 60 seconds, as stipulated in JIS K 6300-2, and 90% vulcanization to the maximum torque value for a vulcanization time of 600 seconds The time [tc(90)] is 300 to 500 seconds. The curable silicone composition for die bonding according to the present invention can strongly adhere a semiconductor chip to a support. |