abstract |
The present invention relates to an adhesive composition for a semiconductor, comprising a thermoplastic resin having low hygroscopicity, an epoxy resin comprising a biphenyl-based epoxy resin having a softening point of 50 ° C to 100 ° C, and a novolac type. A curing agent for a phenol resin, and satisfying IPC/JEDEC moisture sensitivity test level 1; a dicing bonding film comprising an adhesive composition for a semiconductor; and a method of cutting a semiconductor using the dicing bonding film. |