| abstract |
The present invention also provides an adhesive composition for semiconductor and the like which are excellent in package reliability and adhesion in the case of severe heat-humidity conditions and reflow process even after storage for a certain period of time. The adhesive composition for semiconductor according to the present invention has an acrylic polymer (A), an epoxy thermosetting resin (B), a thermosetting agent (C) and an organic functional group and having a molecular weight of 300 or more and an alkoxy equivalent of 13 mmol / g or more A large silane compound (D), and a silane compound (E) having an organic functional group and having a molecular weight of 300 or less and an alkoxy equivalent of 13 mmol / g or less. |