abstract |
The present invention provides a kind of diaphragm seal 1, it is in the manufacturing method of the semiconductor device with the treatment process using alkaline solution, for sealing the semiconductor chip being built in substrate or sealing the semiconductor chip on adhesive sheet, diaphragm seal 1 at least has the adhesive phase 11 of curability, adhesive phase 11 is formed by adhesive composition, which contains thermosetting resin, thermoplastic resin and be less than 550m using minimum coating area 2 The inorganic filler that the surface treating agent of/g is surface-treated.The diaphragm seal 1 is not allowed to be also easy to produce coating expansion. |