| abstract |
The present invention provides a die bonding sheet (101) that is provided with a base material (11) and comprises an adhesive layer (12), an intermediate layer (13), and a film-form adhesive (14) layered in the stated order on the base material (11), wherein (X1–X0)/15×100 is 0 to 2%, (X2–X1)/15×100 is –2 to 0%, and (X2–X0)/15×100 is –2 to 1%, where X0 is the displacement at 23°C of a test piece of the base material (11) when thermomechanical analysis is performed, X1 is the maximum value of the displacement when the temperature has risen to 70°C, and X2 is the minimum value of the displacement when the test piece has been allowed to cool at a temperature of 23°C. |