| abstract |
The subject of the present invention is to provide easy bonding between a support and a wafer, and easy peeling of the wafer from the support, and can improve the productivity of thin wafers, a wafer laminate suitable for thin wafer manufacturing, and its production method. The solution is a wafer laminate, which is provided with a support, an adhesive layer formed on the support, and a wafer laminated on the adhesive layer with a circuit surface facing the surface A wafer laminate, wherein the adhesive layer is composed of a resin layer A with light-shielding properties and a resin layer B containing a non-silicone thermoplastic resin in order from the support side, and the resin layer A It contains a resin containing a repeating unit containing a condensed ring, and the storage modulus E'of the resin layer B at 25° C. is 1 to 500 MPa, and the tensile breaking strength is 5 to 50 MPa. |