| abstract |
The present invention provides an adhesive film capable of producing a high-quality semiconductor device at a high yield, a method of manufacturing a semiconductor device using the same, and a semiconductor device obtained by the method. Embedding a first semiconductor element fixed on the adherend, and further that the first semiconductor element and the other as the second adhesive film for semiconductor element to hold onto an adherend, wherein the thickness greater than the thickness T 1 of the first semiconductor element T Wherein the adherend and the first semiconductor element are connected by wire bonding and the difference between the thickness T and the thickness T 1 is not less than 40 μm and not more than 260 μm or the adherend and the first semiconductor element are flip- And the difference between the thickness T and the thickness T 1 is not less than 10 μm and not more than 200 μm. |