| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02255
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2015-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_329e3054458f4ade1f74e6321b433690
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad8c1a4d20636140bf1c5899f9e5268c |
| publicationDate |
2018-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I640436-B |
| titleOfInvention |
Wafer processing body, temporary bonding material for wafer processing, and manufacturing method of thin wafer |
| abstract |
The invention relates to a wafer processing body, which is a wafer processing body in which a temporary bonding material layer is formed on a support, and a wafer having a surface with a circuit surface and an inner surface to be processed is laminated on the temporary bonding material layer. Among them, the temporary bonding material layer is provided with a composite temporary bonding material layer having a thermoplastic organic polysiloxane polymer layer (A) formed by peelingly bonding the surface of the wafer. The first temporary adhesive layer, the second temporary adhesive layer formed by the thermally curable siloxane-modified polymer layer (B) which can be laminated in a peelable manner from the first temporary adhesive layer, A three-layer composite temporary adhesive layer formed of a third temporary adhesive layer formed by a thermosetting siloxane polymer layer (C) which is laminated and peeled and which is peelably attached to the support. Thereby, a wafer processing body can be provided, which is easy to temporarily adhere and peel, and can improve the temporary adhesive material for wafer processing which can be easily peeled even if the thin wafer before being peeled is cut. Producer of thin wafers. |
| priorityDate |
2014-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |