| abstract |
The present invention provides an underfill film for a semiconductor package that can be optimized for a chip placement method that simplifies transfer and bonding processes during semiconductor packaging and that can improve connection reliability. Kind Code: A1 The present invention relates to an underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the same. More specifically, the present invention relates to an adhesive layer having a melt viscosity and an onset temperature adjusted within a predetermined range. By including, the packaging process is simplified, the production efficiency is improved, and the connection reliability of the package can be improved. [Selection drawing] Fig. 1 |