| abstract |
There is provided a circuit member connection sheet capable of manufacturing a highly reliable semiconductor device in which a connection resistance at a connection portion hardly changes. A circuit member connecting sheet 1 interposed between electrodes facing each other and used for electrically connecting the electrodes facing each other, wherein the circuit member connecting sheet 1 is connected to a substrate 11. A pressure-sensitive adhesive layer 12 laminated on at least one surface side of the base material 11, and a curable adhesive layer 13 laminated on the surface side of the pressure-sensitive adhesive layer 12 opposite to the base material 11, The material constituting the agent layer 13 has a melt viscosity at 90 ° C. of 1.0 × 10 0 Pa · s or more and 5.0 × 10 5 Pa · s or less before curing, and 0 to 130 ° C. of the cured product. The circuit member connection sheet 1 having an average linear expansion coefficient of 45 ppm or less. [Selection] Figure 1 |