http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016046299-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d31bbe07dd1354d60645e92a187a600 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6676acb826e82e48899dd73b5e127908 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6542bb7a0e2a09022a466ede6627fdff |
| publicationDate | 2016-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016046299-A |
| titleOfInvention | Adhesive for sealing semiconductor connection part, semiconductor device using the same, and method for manufacturing semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an adhesive for sealing a semiconductor connection part which is excellent in heat dissipation and filling properties, eliminates oxides and impurities, and has excellent reflow resistance, and a semiconductor device using the same, and its A manufacturing method is provided. In a semiconductor device in which respective connection portions of a semiconductor chip and a printed circuit board are electrically connected to each other, or a semiconductor device in which respective connection portions of a plurality of semiconductor chips are electrically connected to each other. A semiconductor connection part sealing adhesive used for sealing a connection part, wherein (a) an epoxy resin, (b) a curing agent, (c) a polymer resin component having a weight average molecular weight of 10,000 or more, (d) a surface Treated alumina filler, the thermal conductivity of the cured product is 0.5 W / mK or more, the shear adhesive strength at 260 ° C. (5 mm square) is 2.5 MPa or more, the heating rate is 10 ° C./min, the measurement range The adhesive for semiconductor connection part sealing whose minimum melt viscosity in 30-180 degreeC is 7000 Pa.s or less. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022024648-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017188306-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021200553-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017195517-A1 |
| priorityDate | 2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 96.