| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c19a91365ed494d9fe27d24190d4459f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81447
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81951
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29294
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1369
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83104
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29199
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2731
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2732 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-91
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2019-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a90d8dc0195d40e8061097a4436d77e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a05e92c4cb3246f75ff50f1fd3b1db9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f6cf246f23c9cb2562a4ab92df6ed9e |
| publicationDate |
2022-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11495564-B2 |
| titleOfInvention |
Electronic-part-reinforcing thermosetting resin composition, semiconductor device, and method for fabricating the semiconductor device |
| abstract |
An electronic-part-reinforcing thermosetting resin composition has: a viscosity of 5 Pa·s or less at 140° C.; a temperature of 150° C. to 170° C. as a temperature corresponding to a maximum peak of an exothermic curve representing a curing reaction; and a difference of 20° C. or less between the temperature corresponding to the maximum peak and a temperature corresponding to one half of the height of the maximum peak in a temperature rising range of the exothermic curve. |
| priorityDate |
2018-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |