| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-085 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14 |
| filingDate |
2020-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba226f4e5a5fd9e302c18a8119943163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ec2803beaa40412e6d5ee1caf8cfe34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41a1d9b4154047ff392fe139427c0e09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4c5e3e3408f9f32227d7cf1dd304032 |
| publicationDate |
2021-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2021085593-A1 |
| titleOfInvention |
Resin composition, cured product, composite molded body and semiconductor device |
| abstract |
The present invention provides: a resin composition which has excellent thermal conductivity and excellent adhesion to a metal, and which enables the achievement of a cured product that is not susceptible to interfacial debonding if complexed with a metal; a cured resin which has excellent thermal conductivity and excellent adhesion to a metal, and which is not susceptible to interfacial debonding if complexed with a metal; a composite molded body which has excellent thermal conductivity and excellent adhesion to a metal, and which is not susceptible to interfacial debonding; and a semiconductor device which has excellent heat dissipation performance and excellent adhesion between a cured resin and a metal, and which is not susceptible to interfacial debonding. A resin composition according to the present invention contains an inorganic filler, a thermosetting resin an a thermosetting catalyst; the inorganic filler contains aggregated inorganic fillers; the thermosetting resin contains an epoxy resin; and two or more thermosetting catalysts having a melting point of 100°C or higher are contained. A cured resin according to the present invention is a cured product of the above-described resin composition; a composite body according to the present invention comprises the above-described cured resin and a metal; and a semiconductor device according to the present invention comprises the above-described composite body. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023182470-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023189030-A1 |
| priorityDate |
2019-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |