| abstract |
It is possible to construct a simple and low-cost process, and has high process suitability for TSV formation, backside wiring process, excellent thermal process resistance, and a circuit board substrate with a circuit board capable of increasing the productivity of a thin board, and a circuit board processing Provide a method. A temporary adhesive material layer is laminated | stacked on the support body so that peeling is possible, and this temporary adhesive material layer has a circuit surface on the surface, and it is laminated | stacked on the surface of the circuit equipped board | substrate which should process back surface, As a board | substrate process body with a circuit, The temporary adhesive layer includes a thermosetting siloxane polymer layer (A), and the peeling force when the polymer layer (A) is subjected to interfacial peeling from the support after curing is 10 to 500 mN / 25 mm in a 180 ° peel test. Moreover, the peeling force at the time of an interface peeling from a circuit board with a polymer layer (A) after hardening is 50-1000 mN / 25mm in 180 degree peel test, The circuit board processed object characterized by the above-mentioned. |