| abstract |
The invention provides a method for assembling a microelectronic component, which comprises the following steps: providing a conductive grain bonding material including a conductive thermosetting resin material or a flux-based solder, and a conductive thermoplastic material crystal A dynamic release layer adjacent to the grain bonding material layer; and irradiating a laser beam on the dynamic release layer adjacent to the grain bonding material layer; therefore, the dynamic release layer is activated to direct the conductive grain bonding material substance The pad structure to be treated so as to cover a selected portion of the pad structure with a transferred conductive grain bonding material; and wherein the time and energy of the laser beam are limited, so that the grain bonding material substance remains thermosetting. Therefore, the adhesive substance can be transferred while preventing the adhesive from failing due to excessive thermal exposure during the transfer procedure. |