Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_384c7faf9472c736c78e2e786277cf8b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2461-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-408 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2463-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31612 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2650-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J171-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-35 |
filingDate |
2011-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2013-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2347c2246e7bc9d61add26c14e86e77b |
publicationDate |
2013-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8617705-B2 |
titleOfInvention |
Adhesive composition and sheet for forming semiconductor wafer-protective film |
abstract |
There is disclosed an adhesive composition containing: (A) 100 parts by mass of a phenoxy resin; (B) 5 to 200 parts by mass of an epoxy resin; (C) 1 to 20 parts by mass of an alkoxysilane-partial hydrolytic condensate which is a partial hydrolytic condensate of alkoxysilane including one kind or two or more kinds of alkoxysilane represented by the following general formulae (1) and (2)n nSi(OR 3 ) 4 (1)n nR 1 Si(OR 3 ) 3 (2),n nwherein the weight average molecular weight is 300 or more and 30,000 or less and an amount of residual alkoxy is 2 wt % or more and 50 wt % or less; (D) a curing catalyst for an epoxy resin; (E) an inorganic filler; and (F) a polar solvent having a boiling point of 80° C. to 180° C. and a surface tension of 20 to 30 dyne/cm at 25° C. There can be a sheet for forming a semiconductor wafer-protective film and an adhesive composition capable of forming a protective film excellent in evenness, cutting characteristics and adhesiveness. |
priorityDate |
2010-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |