| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_703d9b340cb2c6993a74a012f08f26b7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15747
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
| filingDate |
1994-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1997-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c62987597ec7c5a83ab1f9fd6b08f73 |
| publicationDate |
1997-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-0124788-B1 |
| titleOfInvention |
Copper oxide-filled polymer die attach adhesive composition for semiconductor packages |
| abstract |
The present invention relates to a new package die attach adhesive composition for maintaining a stable electrical conductivity under a temperature cycle and providing sufficient bonding force between the semiconductor chip die and the leadframe pad to prevent package cracks and delamination. Thus, copper oxide-filled mainly in the die attach adhesive composition containing a small amount of silver (Ag), which tends to have high ion migration, as an inorganic filler, or which contains chemically stable copper oxide instead. Copper oxide-filled polymer die attach adhesive composition maintains stable electrical conductivity even under T / C -65 ° C / 150 ° C and improves adhesion to suppress package cracks due to interlayer peeling. It is possible to manufacture a highly reliable semiconductor package. |
| priorityDate |
1994-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |