| abstract |
An adhesive tape 101 electrically connecting conductive components includes a resin layer 132 containing a thermosetting resin, a solder powder 103 and a curing agent. The solder powder 103 and the curing agent reside in the resin layer 132 , the curing temperature T 1 of the resin layer 132 and the melting point T 2 of the solder powder 103 satisfy T 1 ≧T 2 +20° C., wherein the resin layer 132 shows a melt viscosity of 50 Pa·s or above and 5000 Pa·s or below, at the melting point T 2 of the solder powder 103. |