| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2463-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2433-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2461-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10 |
| filingDate |
2012-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b957f074d56e5f1bfb1bdbb58575ef42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a12b3e1ed4253e7bb6782495c9bbde47
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48b03303a847852712431db578a948b1 |
| publicationDate |
2012-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201247815-A |
| titleOfInvention |
Adhesive sheet for fabrication of semiconductor apparatus |
| abstract |
An adhesive sheet is provided, wherein the adhesive sheet is capable of preventing deterioration of electrical properties of the fabricated semiconductor apparatus and thereby enhancing product reliability through capturing cations mixing from the external during the fabricating process of semiconductor apparatus. The adhesive sheet for fabrication of semiconductor apparatus has the following characteristics. After immersing 2.5g weight of the adhesive sheet for fabrication of semiconductor apparatus into 50ml of aqueous solution containing 10ppm copper ions and placing at 120 DEG C for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9ppm. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I650352-B |
| priorityDate |
2011-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |