| abstract |
Disclosed is a dicing die-bonding film having an adhesive layer that can be cured in a short time while being excellent in storage stability and can be appropriately wire-bonded after curing. A dicing tape having a laminated structure including a base material and a pressure-sensitive adhesive layer, and an adhesive layer that is detachably adhered to the pressure-sensitive adhesive layer in the dicing tape, the adhesive layer comprising: It contains a thermosetting component, a filler, and a curing accelerator, and the calorific value by DSC measurement after heating at 130 ° C. for 30 minutes is 60% or less of the calorific value before heating, at 130 ° C. after the heating. A dicing die-bonding film having a storage elastic modulus of 20 MPa to 4000 MPa. [Selection] Figure 1 |