| abstract |
(B1) a thermosetting component having a softening point of less than 50 캜, (B2) a thermosetting component having a softening point of 50 캜 or more and 100 캜 or less, (C) a thermosetting component having a softening point of 100 캜 or less (B1) a thermosetting component having a softening point lower than 50 deg. C in an amount of 10 to 20 mass% based on 100 mass% of the resin composition; (B) 10 to 20 mass% of a thermosetting component having a softening point of 50 to 100 ° C, and (C) 15 to 30 mass% of a phenol resin having a softening point of 100 ° C or less. |