| abstract |
PROBLEM TO BE SOLVED: To provide a dicing film with a protective film capable of reducing downtime and allowing a dicing film to be attached to a semiconductor wafer without causing a positional shift. A dicing film with a protective film in which a dicing film and a protective film are laminated, wherein the transmittance of the protective film at a wavelength of 600 to 700 nm and a portion of the dicing film through which light for film detection is first transmitted. A dicing film with a protective film, wherein a difference from the transmittance of the dicing film with a protective film is 20% or more. [Selection] Figure 1 |