| abstract |
The present invention provides a bonding film, a tape for wafer processing, a method for producing a bonding body, and a bonding body having sufficient heat resistance and high reliability, and a simple bonding process for bonding a semiconductor element to a substrate. The bonding film of the present invention is a bonding film (13) for bonding a semiconductor element (2) and a substrate (40), and is obtained by molding a conductive paste containing metal fine particles (P) into a film shape. the conductive bonding layer (13a), and the adhesive layer (13b) which has adhesiveness and is laminated on the conductive bonding layer. The adhesive layer (13b) thermally decomposes the adhesive layer (13b) by heating at the time of bonding, and the metal particles (P) of the conductive bonding layer (13a) are sintered, whereby the semiconductor element (13b) is sintered. 2) Bonding with the substrate (40). |