| abstract |
The present invention relates to an adhesive film for a semiconductor package, and more particularly includes an epoxy group-containing acrylic copolymer (A) and a carboxyl group-containing acrylic copolymer (B), an epoxy resin, a phenol resin curing agent, an inorganic filler, and a coupling agent. Including a bonding layer composed of a mixture, to prevent the bonding defects and chip cracks due to bouncing in the high-temperature wire bonding process, to prevent the chip-chip shake due to the fluidity of the adhesive film and to have a high heat resistance to ensure high reliability. |