| abstract |
The present invention is a resin sheet, which is a resin sheet for sealing electronic parts in a method for manufacturing a semiconductor device. The resin sheet includes a hardenable resin composition layer, and the resin composition layer is composed of a resin containing a coloring material. The coloring material includes at least one of a carbon-based material having a ratio of carbon atoms constituting an aliphatic hydrocarbon group to all carbon atoms of more than 3% by mass, and at least one insulating metal compound. The resin composition layer is a cured layer that is cured The light transmittance at a wavelength of 1500 to 1000 nm is less than 40%, and the light transmittance at a wavelength of 800 to 400 nm is less than 10%. According to this resin sheet, while the obtained semiconductor device can achieve excellent concealment of electronic components, it can also suppress erroneous operation due to external electromagnetic waves, and the cured layer hardened by the resin composition layer has excellent insulation properties. |