| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c4e3691f40afd3ec555105cc14d49797 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2200-0647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
| filingDate |
2017-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13ff52de426ff6fb22a40adb0fe093d3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ade129cbd2ebb10e0defae27e0e883d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d3d8a1eec801b13454fe4b02135fe77 |
| publicationDate |
2019-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3442010-A1 |
| titleOfInvention |
Adhesive film for use in semiconductor device manufacturing, and semiconductor device manufacturing method |
| abstract |
An adhesive film (50) for manufacturing a semiconductor device according to the present invention is used for temporarily fixing an electronic component (70) when encapsulating the electronic component (70) with an encapsulating material (60) in a manufacturing process of a semiconductor device. The film (50) includes a base material layer (10), and an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10) and for temporarily fixing the electronic component (70). Surface free energy of a surface of the adhesive resin layer (A) is equal to or less than 38.0 mN/m. |
| priorityDate |
2016-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |