| abstract |
An energy-beam curable hydrophilic pressure-sensitive adhesive composition comprising a hydrophilic pressure-sensitive adhesive (A), an energy ray-polymerizable compound (B), and a photopolymerization initiator (C), if necessary. Therefore, even if an adhesive remains on the wafer surface after peeling an adhesive sheet, the adhesive composition suitable for the wafer surface protection sheet which can wash easily with water and can remove a residual adhesive easily is provided. |