| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2201-622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20 |
| filingDate |
2018-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a1d4240d37d0b60427ea67f4c35478f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c556e81593bc354b46276382248ded0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_025e7811da0dc0af8ecc2c5081cd42c5 |
| publicationDate |
2020-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20200026177-A |
| titleOfInvention |
Manufacturing method of adhesive sheet for stealth dicing and semiconductor device |
| abstract |
At least, as the adhesive sheet 1 for stealth dicing used in order to cut | disconnect a semiconductor wafer in which the modified layer was formed inside with the individual chip in the environment of -20 degreeC or more and 10 degrees C or less, the base material 11 and the said base material ( 11) and a pressure-sensitive adhesive layer 12 laminated on one side of the surface, and in the case where the stealth dicing pressure-sensitive adhesive sheet 1 is affixed on a silicon wafer through the pressure-sensitive adhesive layer 12, The adhesive sheet for stealth dicing (1) whose shear force in 0 degreeC of the interface of the said silicon wafer is 30 N / (3 mm * 20 mm) or more and 190 N / (3 mm * 20 mm) or less. Such a stealth dicing adhesive sheet 1 can sufficiently widen a chip | tip gap by cool expansion, and can suppress the chip | tip collision resulting from the opening in the expanded state. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200024126-A |
| priorityDate |
2017-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |