| abstract |
The subject of the present invention is to provide a wafer laminate suitable for thin wafer manufacturing, which is easy to join the support and the wafer, and can be easily peeled from the support of the wafer, and can improve the productivity of thin wafers. Production method. As a solution, a wafer laminate is provided, which is a wafer laminated with a support, an adhesive layer formed on the support, and a surface of the adhesive layer having a circuit surface facing each other. The wafer laminate of is characterized in that the aforementioned adhesive layer is a cured product of an adhesive composition containing a resin A having light-shielding properties and a resin B containing a silicone skeleton. |