| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c62268de3e92657ca5b9adcac4778225 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2887
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2848
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2312-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2007-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dab21c184cfa5d018293409a206d3947
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae1d33f2312f6b82cf355706782174b6 |
| publicationDate |
2010-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20100100786-A |
| titleOfInvention |
Manufacturing method of pressure-sensitive adhesive, pressure-sensitive adhesive sheet, multilayer pressure-sensitive adhesive sheet and electronic components |
| abstract |
The multilayer adhesive sheet 100 is a die attach film formed by laminating on a pressure-sensitive adhesive layer 103 formed by applying a pressure-sensitive adhesive having a specific composition to the base film 106 and the base film 106 and the pressure-sensitive adhesive layer 103. 105 is provided. The multilayer adhesive sheet 100 using the pressure-sensitive adhesive having this specific composition is excellent in the retention of the die chip 108 at the time of dicing the silicon wafer 101, and has a ring frame (at the time of dicing the silicon wafer 101). It is difficult to remove the multilayered adhesive sheet 100 from 102, and peeling of the die attach film 105 and the adhesive layer 103 is easy at the time of the pick-up of the die chip 108. |
| priorityDate |
2007-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |