http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113451195-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68336 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate | 2021-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2074654a604983ca9dec315ab73a052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d90cbc89fef1ad1d745689c4bf33a56 |
| publicationDate | 2021-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113451195-A |
| titleOfInvention | Sheet for manufacturing semiconductor device and method for manufacturing sheet for manufacturing semiconductor device |
| abstract | The present invention relates to a sheet for manufacturing a semiconductor device, comprising a substrate, a first adhesive layer, a film-like adhesive, a release film, a second adhesive layer, and a support substrate, wherein the substrate is sequentially laminated on the substrate. The first pressure-sensitive adhesive layer, the film-like pressure-sensitive adhesive, the release film, the second pressure-sensitive adhesive layer, and the support base material are formed, and the release film, the second pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are laminated in this order. The thickness of the composite release film of the structure of the adhesive layer and the support substrate is greater than 38 μm. |
| priorityDate | 2020-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.