| abstract |
The present invention provides a resin composition with high heat resistance, and a cured film and a laminated film using the resin composition. The resin composition exhibits good adhesiveness at a low temperature below 180° C. High temperature above ℃ does not generate volatile components due to decomposition, etc., and even after the heat treatment process, the increase in adhesive force is small, so when peeling the substrate, it can be easily peeled at room temperature. A resin composition, a cured product and a laminated film using the resin composition, the resin composition includes a polyimide resin and a methylol compound, and the resin composition is characterized in that the The polyimide-based resin has an acid dianhydride residue and a diamine residue, and, as the diamine residue, at least a polysiloxane-based diamine residue represented by the following general formula (1) and The residue of an aromatic diamine bearing a hydroxyl group. (n is a natural number, and the average value of n calculated from the average molecular weight of polysiloxane diamine is in the range of 5 to 30. R1 and R2 may be the same or different, each representing an alkylene having 1 to 30 carbon atoms group or phenylene group. R 3 to R 6 may be the same or different, each representing an alkyl group, phenyl group or phenoxy group with 1 to 30 carbon atoms.) |