| abstract |
The present application relates to an adhesive composition, an encapsulation film comprising same, an organic electronic device comprising same, and a method for manufacturing the organic electronic device, and provides an adhesive composition that enables the formation of a structure that can effectively block moisture or oxygen from entering the organic electronic device from the outside, exhibits excellent processability during a panel manufacturing process, and at the same time, has excellent heat resistance maintaining force in a condition of high temperature and high humidity. |