| abstract |
An object of the present invention is to reduce the effect of electromagnetic waves emitted from one semiconductor chip on other semiconductor chips, mounted substrates, adjacent devices, packages, and the like in the same package. In order to solve this problem, an adhesive film for a semiconductor device having an adhesive layer and an electromagnetic shielding layer, wherein the amount of attenuation of electromagnetic waves transmitted through the adhesive film for a semiconductor device is 3 dB or more in at least a part of the frequency range of 50 MHz to 20 GHz. To provide. |