abstract |
A pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a heat-resistant layer; a base layer; and a pressure-sensitive adhesive layer in this order, wherein: the pressure-sensitive adhesive tape has an elastic modulus, i.e., Young's modulus at 25 DEG C of 150 MPa or less; and the heat-resistant layer contains a polypropylene-based resin polymerized by using a metallocene catalyst, the polypropylene-based resin having a melting point of 110 DEG C to 200 DEG C and a molecular weight distribution ''Mw/Mn'' of 3 or less. |