| abstract |
An adhesive composition that can be suitably used for the manufacture of a semiconductor device, in particular, it is difficult for voids to be generated between bumps during bonding, the bumps are not likely to be displaced, and even after soldering is completed. Provided is an adhesive composition that hardly causes voids. An adhesive composition containing a polymer (A) having a reactive functional group, a thermosetting resin (B), and a compound (C) having a flux activity, having a minimum melt viscosity of 500 Pa · s. The adhesive composition is characterized in that the temperature at which the minimum melt viscosity is less than 200 ° C. and the melt viscosity at 200 ° C. is 500 Pa · s or more. [Selection figure] None |