| abstract |
Disclosed is a process for producing an electronic device, which comprises the steps of: arranging a resin layer (3) comprising a flux-activating compound and a heat-curable resin between a first terminal (11) of a first electronic component (1) and a second terminal (21) of a second electronic component (2) to produce a laminate (4); heating the laminate (4) to a temperature equal to or higher than the melting point of a solder layer (112) of the first terminal (11) while applying a pressure to the laminate (4) by using a fluid to solder the first terminal (11) and the second terminal (21) to each other; and curing the resin layer (3). In the step of soldering the first terminal (11) and the second terminal (21) to each other, the time between a time point immediately after the initiation of the heating of the laminate (4) and a time point at which the temperature of the laminate (4) reaches the melting point of the solder layer (112) is 5 seconds to 15 minutes inclusive. |